Specifications:
-PCB dimension: W20*20~W450*W400mm
-Workable area:W400*D500mm
-PCB thickness: 0.5~5mm
-Applicable chip size: 1*1~70*70mm
-Placement precision: ±0.01mm
-PCB locating way: outer or jig
-Working table adjustment: ±10mm forward/backward, ±10mm left/right
-Temperature control: K-type thermocouple, close cycle controlled
-System total power: 8000W
-Upper heater: 1000W
-Lower heater: 1000W
-Power supply: single-phase 220V, 50/60Hz, 8KW
-Machine dimension: L870*W900*H1730mm
-Weight: Appox 300kgs
Features:
●7 electric motors controls all actions; vision system, top heating system and under heating system are
all controlled by joystick; makes alignment fast;
●Heater head and suction nozzle designed 2 in 1; functioned with auto-rotate, auto-align, auto-solder
and auto-desolder; ally nozzle can be located in 360°;
●Three independent heating systems, temperature and time can be displayed digitally on the touch
screen, able to repair difficultly-reworked BGA; with alarm function in abnormal heating;
●Both top and under heater are movable on the IR preheating area to fit for reworking BGA in different
positions on PCB;
●The top heater adopts independent patent design, cooling and heating designed 2 in 1, which makes
temperature control more accurate;
●The bottom heater is consist of 6 pieces of imported light-wave heating tube. With high-temperature
glass plate, heating can be controlled individually. The traditional temperature control mode of on-off
control is replaced by analog quantity control, which makes temperature more accurate;
● Top heater driven by servo motor; suction nozzle can identify material and mounting height automatically,
and can control the air pressure within a small range; auto memorize different BGA heating positions and
alignment positions;
●Color optical system with functions of split vision, zoom - in and micro-adjustment, equipped with aberration
detection device; with auto focus and software operation function,27X optical focus; able to rework BGA sized
up to 70mm*70mm;
●Touch screen interface, PLC control; able to display set temperature curves and five detecting temperature
curves at the same time; 6 segments of temperature up (down) and 6 segments constant temperature control, more
than 50000 groups of profile can be stored.; Profile analysis can be carried out on the touch screen;
● PCB support holder can be pulled out to fix and block the board; with laser pointer for alignment, easy to fix PCB;
● with function of Bar code scanner reading program;
● designed with a tray for placing BGA automatically;
● Built in vacuum pump; max. vacuum suction up to 80g,which can be micro-adjusted. Suction nozzle can be rotated
in 360°;
● Visible monitoring system, can view the melting procee of the balls;
● Finished the BGA rework process under the nitrogen save through remain the nitrogen joggle in advance, have special
function for saving nitrogen to save cost.