Specifications:
-PCB dimension: W50*D50~W500*D500mm
-PCB thinkness: 0.5~3mm
-PCB locating way: Outer or Jig
-Nozzle heat: 800W
-Bottom preheater: far infrared 3600W
-Machine dimension: L840×W680×H560mm
-Temperatur control: K-type thermocoupleclose cycle controlled
-Lower hot-air heater: 800W
-Power supply: single-phase, 220V,50/60Hz
-Weight: Appox 55kgs
Features:
●Made of high quality heating material; desoldering and soldering procedures of BGA are precisely controlled;
●Air flow and temperatures are adjustable in a wide range to produce high temperature breeze;
●Movable heating head, easy to operate.
●Touch screen interface, PLC control, able to display temperature curves and detecting curves at the same time.
●Three independent heating areas, temperatures and time can be displayed digitally on the touch screen;
●8 segments of temperature up (down) and 8 segments constant temperature control, 50 groups of temperature -
curves are stored;
●The height of bottom heating nozzle is miro-adjustable;
●The whole preheating zone can moved horizontally, so as to be suitable for more types of BGA and PCB of bigger
size.