Features:
●Carry on selective light wave soldering to the partial through-hole device; able to rework fastenings,
Big heat capacity components socket and multi-basepin components;
●Able to remove wide range of devices up to 180mm in length;
●Double laser instructions, simple and practicable;
●Temperature and motor speed are closed-loop controlled by the PLC; with fast temperature setting,
temperature is continuously adjustable between upper limit and lower limit.
●Easy and efficient to remove components, PCB and componnets heated evenly;
●Simply and safe to operate, easy to maintain, nozzle easy to replace;
●Foot switch controls the wave soldering starting, tin-spraying height is continuously adjustable;
●Little dross, save tin solder
Specification:
-Max. component size:180mm
-PCB thickness:0.8-5mm,maximum 10mm
-Workable PCB size:450mm×500mm
-PCB stents lifting height:30mm
-Tin pump running adjustable time:1-900sec.
-Temperature Precision:±2℃
-Heating temperature:260-350℃
-Input Voltage:220V
-Power:2.1Kw
-Boundary dimension:460*460*360mm
-Gross weight:80kgs