Ideal for matrix and standard power leadframe applications, including TO-220, TO-247, D-Pak, Multilead SOP and DSO packages.
The 7200Plus is designed specifically for the power semiconductor industry. Focusing on the needs and trends in this market allowed Orthodyne to engineer a bonder that excels at meeting today's packaging challenges. The 7200Plus has high productivity, process stability, low cost of ownership (COO) and the flexibility to grow with market demands.
The pluses built into the 7200Plus come from Orthodyne's experience and understanding of changing customer needs. Our commitment to outstanding performance, exceptional customer service and ongoing product development has made a better bonder even better.
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Low Cost of Ownership
High UPH: The low-mass bondhead and XY table design, together with high performance drives and advanced motion control technology, provide exceptional speed and reliability, resulting in the most productive bonder for power semiconductors.
Single- and Multi-Head Configurations: The 7200Plus platform design provides maximum flexibility. Single- and Multi-head versions let you configure your production line with exactly the number of bondheads required to balance the production flow.
High-Speed Programmable Indexer: 150 ms for a TO-220 device. Users can store and recall parameters and indexer positions to reduce programming time and calibration time.
On-Board Diagnostics: Continuous feedback of major equipment functions results in higher uptime and controlled performance.
Bondhead Design: Low-maintenance and low-mass bondhead design allows for the highest UPH, excellent process control and unmatched uptime.
Enhanced PR System: Orthodyne's enhanced third-generation GS3 pattern recognition system is optimized for power device applications and provides a variety of tools to ensure high-speed and reliability.
Pullout Clamp Station: Allows the user to have a second set of tooling readily available for quick product changeover and minimized downtime.
Advanced Quality Tools
Bond Process Monitoring: The optional BPM system monitors bond deformation and the ultrasonic signal in real-time. Bonds that fall outside user-defined limits are flagged and vital process information can be stored for evaluation.
Active Loop Control (ALC) Bondheads: Available in Front or Rear Cut versions, the ALC bondhead design provides excellent loop shape control and non-destructive pulltest capability.
Pulltesters: Up to 4 optional in-line transport pulltesters per bonder module provide non-destructive pulltest and loop height check capability for standard and matrix leadframes.
Flexible Cutting Edge Capabilities
Matrix Capabilities: The 7200Plus features full capabilities for matrix leadframes up to 72mm wide.
Small Wire, Large Wire, PowerRibbon®: Each bonder module can be easily configured to large wire, small wire, or PowerRibbon® providing flexibility for a wide product spectrum.
Networking: Simple networking via Ethernet. SECS/GEM is available as an option.
Software: A GUI-based software structure offers simplified, user-friendly machine operation and sophisticated troubleshooting tools resulting in lower training cost and increased uptime.
File Handling: A USB port, DVD-RW, hard drive, and networking capabilities provide easy-to-use tools for data transfer, data storage, and program back-up.
Advanced Looping Algorithms: Constant loop length or height are just two of the many standard looping features of the 7200Plus. Customized looping scrips for the most demanding applications are created by Orthodyne Applications Engineers with Orthodyne's Loop Development Tool (LDT)