SB²-Jet - יישום כדוריות BGA
מערכת אוטומטית להרכבה.תיקון כדוריות בדיל.
SB²-Jet
The SB²-Jet solder ball system is the ideal solution for flexible solder ball placement and laser reflow. At a speed of 10 balls per second, it is one of the fastest
machines on the market today. It provides a reproducible solder bumping technology for the packaging of :
Wafers, Optoelectronic Devices, MEMS, Sensors,BGA's , CSP, Flip Chips, HDD (HGA, HSA)
http://shop.hbentz.com/Content/editor/sbjet.pdf
Specifications:
· Single-step solder ball placement and reflow
· Fluxfree reflow with laser
· No special tooling required
· No additional reflow required
· Solder ball diameter from 80µm up to 760µm
· Solder allay flexibility:
· Eutectic & high-lead SnPb
· Leadfree SnAg, SnAgCu, AuSn
· In-Line capability, robot cassette to cassette handling
· High throughput
· Accurate positioning system
· Ball rework & repair capability
· Ball inspection system