The circuit shows three dimensional interconnect applied to a stack of circuit boards encased in an epoxy resin. The circuit boards carry ULSI Flash memory devices. The connection points to the memory boards on the surface of the stack have been interconnected using 10 micron thick copper plating and finished with nickel and gold suitable for wire bonding. The connection to the package header is made using aluminium wire. Whilst not a ceramic circuit, the technology employs AIT's standard processing.