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MicroMax
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MicroMax® is a compact, high-throughput conveyorized system for non-heated applications.
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MAX II Series
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MAX II Series
These systems were designed primarily for high volume underfill and the encapsulation process
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DS9000 Series
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DS9000-SA and DS9000-IL
Ideal for dispense applications utilizing adhesive, solder paste, solder mask, conductive adhesive, potting .
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